B1. Empowering Resilience with Technology and Design
B1.: Empowering Resilience with Technology and Design (Posters)

(Group 1, Poster Board #34)

NIST on a Chip: Quantum-Based Sensors for the Pressure, Vacuum, Temperature and More!

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JH
Jay Hendricks NIST
BG
Barbara Goldstein NIST

Published in 3rd Innovations in Climate Resilience Conference
Publisher Battelle
Date of Conference April 22–24, 2024